Join us for this live webinar which will focus on applying Automated Atomic Force Microscopy (AFM) in inline metrology of hybrid bonding in the semiconductor industry.

Bruker’s fully automated AFM solutions enable the highly accurate, non-destructive, nanoscale characterization of surfaces, while delivering high-throughput data for inline process control and actionable data for hybrid bonding yield enhancement.

In this webinar, we will illustrate how Automated AFM can be applied in the most current hybrid bonding technology nodes and wafer processing steps, and its suitability for labs and fabs working on new bonding device design. The following topics will be discussed:

• Key Automated AFM features for process control in high volume manufacturing of bonded wafers
• High resolution imaging and analysis for critical bond pad metrology
• Large-area scanning of areas of up to 100s of mm² for large scan topography in wafer-to-wafer bonding
• Automated bevel edge metrology for hybrid bonding
• Patterned and bare/blanket wafer defect review

Webinar Speakers

Sean Hand
Senior Applications Scientist
Bruker Semiconductor Division

Dr. Ingo Schmitz (Chair)
Director, Business Manager AAFM Products
Bruker BNSM